POLISHING PAD
As a core business of CHIYODA CIEGAL, we manufacture and develop polishing pads.
To meet diverse and advanced technical requirements, we offer a wide range of polishing pads.
01
SUEDE
This material, regarded as a signature product of CHIYODA CIEGAL, is well suited for finishing applications.
It enhances final polishing performance and surface defect-free quality, and also supports various surface treatments, including surface roughness control and groove processing.
- Silicon wafers
- Sapphire wafers
- SiC wafers
- Other compound wafers
- Optical lenses
- Glass
- Others
02
NON-WOVEN FABRIC
This material is suitable for a wide range of applications, from final finishing to primary polishing.
It offers various characteristics, covering materials from low to high hardness. Groove processing, including V-shaped and U-shaped grooves, is also supported.
- Silicon wafers
- Sapphire wafers
- SiC wafers
- Other compound wafers
- Ceramics
- Metals
- Others
03
URETHANE
This material is made of rigid polyurethane resin with a fine porous structure.
It offers excellent durability and chemical resistance, making it suitable for polishing hard and brittle materials such as glass and ceramics. Groove processing, including V-shaped and U-shaped grooves, is also supported.
- Silicon wafers
- Other compound wafers
- Glass
- Ceramics
- Others
